HPCB Process Capability
1
Layers
10 Layers
2
Max Board Size
18" x 26"
3
Min Board Thickness
2 layers 4 layers 6 layers 8 layers 10 layers
8 mil 16mil 32mil 40mil 48mil
4
Min Line Width
4mil
5
Min Line Space
6
Min Hole Size
8mil
7
PTH Wall Thickness
0.8mil
8
PTH dia tolerance
±3mil
9
NPTH hole dia tolerance
±1mil
10
Hole Position Deviation
11
Outline Tolerance
±4mil
12
S/M Pitch
3mil
13
Insulation Resistance
1E+12Ω (Normal)
14
Aspect ratio
10:1
15
Thermal Shock
3x10Sec @ 288'C
16
Warp and Twist
≤0.7%
17
Electric Strength
≥ 1.3KV/mm
18
Peel Strength
≥ 1.4N/mm
19
Solder Mask Abrasion
≥ 6H
20
Flammability
94V-0
21
Impedance Control
±5%