HPCB Process Capability

HPCB-Capability

1

Layers

10 Layers

2

Max Board Size

18" x 26"

3

Min Board Thickness

2 layers
4 layers
6 layers
8 layers
10 layers

8 mil
16mil
32mil 
40mil
48mil

4

Min Line Width

4mil

5

Min Line Space

4mil

6

Min Hole Size

8mil

7

PTH Wall Thickness

0.8mil

8

PTH dia tolerance

±3mil

9

NPTH hole dia tolerance

±1mil

10

Hole Position Deviation

±3mil

11

Outline Tolerance

±4mil

12

S/M Pitch

3mil

13

Insulation Resistance

1E+12Ω (Normal)

14

Aspect ratio

10:1

15

Thermal Shock

3x10Sec @ 288'C

16

Warp and Twist

≤0.7%

17

Electric Strength

≥ 1.3KV/mm

18

Peel Strength

≥ 1.4N/mm

19

Solder Mask Abrasion

≥ 6H

20

Flammability

94V-0

21

Impedance Control

±5%

 

 

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